The microQSFP MSA will develop a specification for a new compact module form factor, microQSFP, and make the specification available to the industry to promote industry adoption of compatible products that can be used for a variety of applications including copper cable and fiber-optics transceivers in a manner similar to SFP or QSFP form factors. There will be sufficient details in the specification such that the components of the form factor (host board electrical edge connector, cage and plug with latching mechanism, where the plug can be a cable termination or transceiver) are mechanically and electrically interchangeable if compliant to the specification.
The microQSFP specification is expected to be applied to direct attach cables (DACs), active optical cables (AOCs), and connectorized optical modules to enable higher port density. The microQSFP module’s compact design will be well suited for a wide range of applications within the data center accommodating copper, VCSEL (vertical cavity surface emitting laser), SM (single mode) laser or Silicon Photonics (SiP) based technology.
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The microQSFP specification is expected to be applied to direct attach cables (DACs), active optical cables (AOCs), and connectorized optical modules to enable higher port density. The microQSFP module’s compact design will be well suited for a wide range of applications within the data center accommodating copper, VCSEL (vertical cavity surface emitting laser), SM (single mode) laser or Silicon Photonics (SiP) based technology.